CPU Enclosure
CFD Lesson 7: SOLIDWORKS Enclosure and 3DEXPERIENCE Fluid Scenario Creation
In this SOLIDWORKS assembly save your model to the 3DEXPERIENCE platform and manage your data with PLM attributes. Define two physics conditions to investigate internal turbulent air flow from a fan and thermal effects from a Heat sink and a chip. Use different mesh types and materials to explore capacity, simulation run time, and accuracy. Display and review the Gauge Pressure, Velocity and Temperature contour plot. Examine the temperature at different points throughout the chip, Heat sink and enclosure using a XY Plot from Path.
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